POLYARYLENE SULFIDE RESIN COMPOSITION AND MOLDED BODY THEREOF

PROBLEM TO BE SOLVED: To provide a polyarylene sulfide resin molded body containing a polyarylene sulfide resin, excellent in adhesiveness with an epoxy resin and a cold thermal impact property and less in burr amount and a polyarylene sulfide resin composition capable of molding the molded body.SOL...

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Bibliographic Details
Main Authors KUNISHIGE MASASHI, SHIMAYA TAKU, UCHIGATA MASANORI
Format Patent
LanguageEnglish
Japanese
Published 20.07.2017
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a polyarylene sulfide resin molded body containing a polyarylene sulfide resin, excellent in adhesiveness with an epoxy resin and a cold thermal impact property and less in burr amount and a polyarylene sulfide resin composition capable of molding the molded body.SOLUTION: There are provided a polyarylene sulfide resin composition containing a polyarylene sulfide resin (A), a polyamide ether resin (B) and an epoxy resin (C) as essential components, wherein flexure elastic modulus of the polyamide ether resin (B) is 100 (MPa) or less, and a molded body thereof.SELECTED DRAWING: None 【課題】 ポリアリーレンスルフィド樹脂を含み、エポキシ樹脂との接着性および冷熱衝撃性に優れ、かつバリ量の少ないポリアリーレンスルフィド樹脂成形体および該成形体を成形できるポリアリーレンスルフィド樹脂組成物を提供すること。【解決手段】 ポリアリーレンスルフィド樹脂（Ａ）と、ポリアミドエーテル樹脂（Ｂ）と、エポキシ樹脂（Ｃ）を必須成分とするポリアリーレンスルフィド樹脂組成物であって、ポリアミドエーテル樹脂（Ｂ）の曲げ弾性率が１００（ＭＰａ）以下であることを特徴とするポリアリーレンスルフィド樹脂組成物およびその成形体。【選択図】 なし
Bibliography:Application Number: JP20170086318