PRINTED CIRCUIT BOARD

• Main Authors: CHO JUNG-HYUN, KOOK SEUNG-YEOP, BAEK YONG-HO
• Format: Patent
• Language: English; Japanese
• Published: 13.07.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a printed circuit board which ensures the yield even in a board having a high multi-layer structure and large size, whose lead time is prevented from becoming long and also in which a multi-layer via structure, the precise degree of matching, and excellent electrical characteristics can be obtained.SOLUTION: A printed circuit board includes: a core member 155 in which a through-hole is formed; a sub-circuit board 100 placed in the though-hole; a first insulation layer 180 laminated on both surfaces of the core member and the sub-circuit board; and an insulation member 185 filled between an inner wall 155a of the through-hole and the sub-circuit board.SELECTED DRAWING: Figure 1 【課題】高多層の構造や大きいサイズの基板においても、収率を確保し、リードタイムが長くならず、また、多層のビア構造、精密な整合度及び優れた電気特性が得られるプリント回路基板を提供する。【解決手段】貫通ホールが形成されたコア部材１５５と、貫通ホールに配置されたサブ回路基板１００と、コア部材及びサブ回路基板の両面に積層された第１絶縁層１８０と、貫通ホールの内壁１５５ａとサブ回路基板との間に充填された絶縁材１８５と、を含む。【選択図】図１