RIGID FLEXIBLE BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To suppress cracks from occurring even if a base material is curved in any direction.SOLUTION: Protective layers (solder resist layers 36A, 36B) are formed at a central portion on both surfaces of a flexible and insulating base material 28; and core layers 30A, 30B are formed,...

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Bibliographic Details
Main Authors IRIGUCHI SHIGEO, NAKAMURA NAOKI, ABE MITSUNORI, HATANAKA KIYOYUKI, TAKETOMI NOBUO, KANAI AKIRA
Format Patent
LanguageEnglish
Japanese
Published 13.07.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To suppress cracks from occurring even if a base material is curved in any direction.SOLUTION: Protective layers (solder resist layers 36A, 36B) are formed at a central portion on both surfaces of a flexible and insulating base material 28; and core layers 30A, 30B are formed, on both surfaces of the base material 28, with gaps 46A, 46B in a thickness direction located toward the center of the base material 28 between the protective layers and the core layers, the core layers partially covering the protective layers from a circumferential edge side.SELECTED DRAWING: Figure 1 【課題】基材をいずれの方向に湾曲させても亀裂の発生を抑制する。【解決手段】柔軟で絶縁性を有する基材２８の両面において中央部に保護層（ソルダーレジスト層３６Ａ、３６Ｂ）を形成する。基材２８の両面において、周縁側から保護層に部分的に被り、保護層との間の基材２８の中央寄りに厚み方向の空隙４６Ａ、４６Ｂを開けてコア層３０Ａ、３０Ｂを形成する。【選択図】図１
Bibliography:Application Number: JP20160001175