WIRING BOARD AND MANUFACTURING METHOD THEREOF
PROBLEM TO BE SOLVED: To provide a wiring board by which a fine wiring line can be preferably formed on an insulative layer filling an opening.SOLUTION: A wiring board 20 comprises: a core part 21 with an opening penetrating between a first face and a second face; wiring layers 37 and 38 formed on t...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
06.07.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a wiring board by which a fine wiring line can be preferably formed on an insulative layer filling an opening.SOLUTION: A wiring board 20 comprises: a core part 21 with an opening penetrating between a first face and a second face; wiring layers 37 and 38 formed on the first and second faces of the core part 21 respectively; and a chip capacitor 40 disposed in the opening and protruding further upward than the first face of the core part 21. The wiring board 20 further comprises: an insulative layer 45 formed in part of the opening, and covering a first face of the chip capacitor 40 and part of its side face, part of a first face of a connection terminal 42 of the chip capacitor 40, the first face of the core part 21, part of the wiring layer 37, and part of an inner wall face of the opening; and an interlayer insulative layer 51 covering a first face of the insulative layer 45. In addition, the wiring board 20 comprises: an interlayer insulative layer 61 filling the opening exposed from the insulative layer 45; and a wiring layer 52 electrically connected to the first face of the connection terminal 42 through a via-hole wiring line 67 penetrating through the insulative layers 45 and 51.SELECTED DRAWING: Figure 7
【課題】開口部を充填する絶縁層上に微細配線を好適に形成することができる配線基板を提供する。【解決手段】配線基板20は、第1面と第2面との間を貫通する開口部を有するコア部21と、コア部21の第1面及び第2面にそれぞれ形成された配線層37,38と、開口部内に配置されコア部21の第1面より上方に突出したチップキャパシタ40とを有する。配線基板20は、開口部内の一部に形成され、チップキャパシタ40の第1面及び側面の一部と、チップキャパシタ40の接続端子42の第1面の一部と、コア部21の第1面と、配線層37の一部と、開口部の内壁面の一部とを被覆する絶縁層45と、絶縁層45の第1面を被覆する層間絶縁層51とを有する。配線基板20は、絶縁層45から露出された開口部内を充填する層間絶縁層61と、絶縁層45,51を貫通するビア配線67を介して接続端子42の第1面と電気的に接続される配線層52とを有する。【選択図】図7 |
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Bibliography: | Application Number: JP20170074429 |