INFRARED CUT FILTER, IMAGING APPARATUS AND METHOD OF MANUFACTURING INFRARED CUT FILTER

• Main Authors: TSAI LEI, TAKAYANAGI YOSHIHIRO, SHINMO KATSUHIDE
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2017
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide an infrared cut filter having good infrared cutoff characteristics with little dependency on an incident angle.SOLUTION: An infrared cut filter 10 comprises: a transparent dielectric substrate 12; an infrared reflection layer 14 reflecting infrared and formed on one surface of the transparent dielectric substrate 12; and an infrared absorption layer 16 absorbing infrared and formed on the other surface of the transparent dielectric substrate 12. The infrared absorption layer 16 is formed from resin containing an infrared absorbing dye. The infrared reflection layer 14 is formed from a dielectric multilayer film.SELECTED DRAWING: Figure 1 【課題】入射角依存性が少ない良好な赤外線遮断特性を有する赤外線カットフィルタを提供する。【解決手段】赤外線カットフィルタ１０は、透明誘電体基板１２と、透明誘電体基板１２の一方の面上に形成された赤外線を反射する赤外線反射層１４と、透明誘電体基板１２の他方の面上に形成された赤外線を吸収する赤外線吸収層１６とを備える。赤外線吸収層１６は、赤外線吸収色素を含有する樹脂から形成される。赤外線反射層１４は、誘電体多層膜から形成される。【選択図】図１