COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS

• Main Authors: WATANABE TAKESHI, KIKUCHI RIE, TANEDA YOSHINORI, OGIWARA TSUTOMU, KOORI DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2017
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC CHEMISTRY; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide a compound for forming an organic film that can provide an organic film forming composition having high filling and planarizing properties.SOLUTION: The present invention provides a compound for forming an organic film which has a minimum complex viscosity of 10 Pa s or less when the complex viscosity is measured within a range of 50°C to 300°C.SELECTED DRAWING: None 【課題】高度な埋め込み／平坦化特性を有する有機膜形成用組成物を与える有機膜形成用化合物を提供する。【解決手段】有機膜形成用の化合物であって、５０℃以上３００℃以下の範囲で測定される複素粘性率の最小値が１０Ｐａ・ｓ以下のものであることを特徴とする有機膜形成用化合物。【選択図】なし