COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a copper foil with resin that is excellent in both the peeling strength of an adhesion layer at normal temperature and interlayer adhesion at soldering temperature, and is low in both dielectric constant and dielectric loss tangent of the adhesion layer.SOLUTION: A c...

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Bibliographic Details
Main Authors TAZAKI TAKASHI, TSUJI MASAYUKI, SHIOTANI ATSUSHI, NAKAMURA TAIYOU, YAMAGUCHI TAKASHI
Format Patent
LanguageEnglish
Japanese
Published 06.07.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a copper foil with resin that is excellent in both the peeling strength of an adhesion layer at normal temperature and interlayer adhesion at soldering temperature, and is low in both dielectric constant and dielectric loss tangent of the adhesion layer.SOLUTION: A copper foil with resin is obtained by coating a copper foil with a resin composition comprising a polyimide resin (A) comprising an aromatic tetracarboxylic acid anhydride (a1) and a diamine (a2) comprising a dimer diamine of 30 mol% or more as reaction components, and a thermosetting resin (B).SELECTED DRAWING: None 【課題】接着層の常温での引き剥がし強さ、はんだ付温度における層間密着性が共に良好であり、かつ、接着層の誘電率及び誘電正接がいずれも低いことを特徴とする樹脂付銅箔を提供すること。【解決手段】芳香族テトラカルボン酸無水物（ａ１）及びダイマージアミンを３０モル％以上含むジアミン（ａ２）を反応成分とするポリイミド樹脂（Ａ）並びに熱硬化性樹脂（Ｂ）を含む樹脂組成物を銅箔に塗工してなる樹脂付銅箔【選択図】なし
Bibliography:Application Number: JP20150255911