COMBINED PROCESSING METHOD

• Main Authors: NIITANI HARUHIKO, ISHIDE TAKASHI, HORIE JO, KUREYA MASAYUKI, YAMASHITA TSUGUMARU, TSURUGA SHIGENORI, WATANABE TOSHIYA
• Format: Patent
• Language: English; Japanese
• Published: 06.07.2017
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; COMBINED OPERATIONS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To achieve acceleration of processing by performing laser processing and mechanical processing continuously or in parallel.SOLUTION: A combined processing process comprises: a laser processing process in which an irradiation position of laser beam at which a work-piece including at least CFRP, GFRP or GMT is processed and a processing position of a tool for processing the work-piece are moved according to a prescribed movement reference, and the work-piece is processed with laser beam; and a mechanical processing process in which a position of the work-piece processed with laser beam is processed by the tool subsequently to the laser processing process. In the laser processing process, cutting of the work-piece and boring of a hole are roughly processed with laser beam, and in the mechanical processing process, a cut surface of the work-piece and an opening edge of the hole, which are processed with laser beam, are finished.SELECTED DRAWING: Figure 9 【課題】レーザ加工と機械加工とを連続または並行して加工の高速化を図ること。【解決手段】少なくともＣＦＲＰ、ＧＦＲＰまたはＧＭＴを含む被加工物を加工するレーザの照射位置と、前記被加工物を加工する工具の加工位置とを所定の移動基準に合わせて移動させ、前記レーザにより前記被加工物を加工するレーザ加工工程と、前記レーザ加工工程に続けて前記レーザにより加工した前記被加工物の位置を前記工具により加工する機械加工工程と、を含み、前記レーザ加工工程は、前記レーザにより前記被加工物の切断または穴の貫設を粗加工し、前記機械加工工程は、前記レーザにより加工した前記被加工物の前記切断の面部または前記穴の開口縁を前記工具により仕上げ加工する。【選択図】図９