INSULATING RESIN SHEET AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

• Main Authors: YOON OKSEON, LEE HWAYOUNG, HAM HOHYUNG, LEE JAE-KUL, CHONG SEOLAH
• Format: Patent
• Language: English; Japanese
• Published: 29.06.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a printed circuit board structure in which adhesion between a circuit and an insulating layer does not decrease even if a large amount of filler is contained in an insulating layer on a circuit board.SOLUTION: The insulating resin sheet and the printed circuit board including the same are provided. The printed circuit board includes: the insulating resin layer including a first insulating resin and a filler; an adhesion auxiliary layer laminated on the insulating resin layer and including a second insulating resin and a photosensitive material; and a circuit pattern coupled to the adhesion auxiliary layer.SELECTED DRAWING: Figure 1 【課題】回路基板に多量の充填材が絶縁層に含まれていても、回路と絶縁層との間の接着力が低下しないプリント回路基板構造を提供する。【解決手段】本発明は、絶縁樹脂シート及びこれを備えたプリント回路基板を提供する。本発明の一実施例に係るプリント回路基板は、第１絶縁性樹脂及び充填材を含む絶縁樹脂層と、絶縁樹脂層に積層され、第２絶縁性樹脂及び感光性物質を含む接着補助層と、接着補助層に結合した回路パターンと、を含む。【選択図】図１