PHENOXY RESIN

• Main Authors: MASUDA KATSUYUKI, OKOSHI SHOJI
• Format: Patent
• Language: English; Japanese
• Published: 29.06.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a phenoxy resin having excellent heat resistance and excellent solubility in a general-purpose organic solvent.SOLUTION: The present invention provides a phenoxy resin comprising structural units represented by formula (1) and formula (2) [R-Rindependently represent H, a C1-10 alkyl group, a C3-10 cycloalkyl group, a C6-18 aryl group or a halogen atom, and * is a bond].SELECTED DRAWING: None 【課題】耐熱性、汎用有機溶剤への溶解性に優れるフェノキシ樹脂を提供する。【解決手段】式（１）及び式（２）で示される構造単位からなるフェノキシ樹脂。［Ｒ１〜Ｒ１６は夫々独立にＨ、Ｃ１〜１０のアルキル基、Ｃ３〜１０のシクロアルキル基、Ｃ６〜１８のアリール基又はハロゲン原子、＊は結合手］【選択図】なし