SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

• Main Authors: SAISHO SHIGERU, KUROBANE ATSUSHI, TAKAHASHI KATSUSHI, NADA SEIJI
• Format: Patent
• Language: English; Japanese
• Published: 22.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor element mounting substrate and a semiconductor device capable of preventing drop-off, peel-off and the like of a lead part caused by a shortage of adhesion between the lead part and a resin part when the substrate is pulled off and removed after resin encapsulation, and to provide a method of manufacturing them.SOLUTION: A semiconductor element mounting substrate comprises: a conductive substrate 10 that can be peeled off and removed after a semiconductor element is mounted; a semiconductor element mounting region 20 provided on a surface 11 of the conductive substrate; and a lead part 30 that consists of a plating layer provided in a predetermined region on the surface of the conductive substrate, around the semiconductor element mounting region. The surface of the conductive substrate in the predetermined region where the lead part is provided is a work-affected layer removed surface 12 obtained by removing work-affected layers 13 and 14 by etching processing.SELECTED DRAWING: Figure 1 【課題】本発明は、樹脂封止後、基板を引きはがし除去する時、リード部と樹脂部の密着性不足によるリード部の脱落や剥がれ等を防止することができる半導体素子搭載用基板及び半導体装置、並びにそれらの製造方法を提供することを目的とする。【解決手段】半導体素子搭載後に剥離除去可能な導電性基板１０と、該導電性基板の表面１１上に設けられた半導体素子搭載領域２０と、該半導体素子搭載領域の周囲の前記導電性基板の前記表面上の所定領域に設けられためっき層からなるリード部３０と、を有し、該リード部が設けられた前記所定領域の前記導電性基板の前記表面は、加工変質層１３、１４がエッチング加工により除去された加工変質層除去面１２である。【選択図】図１