PHOTOSENSITIVE RESIN COMPOSITION, INSULATION FILM MADE OF THAT COMPOSITION, AND PRINTED CIRCUIT BOARD COMPRISING THAT INSULATION FILM

• Main Authors: KANG JUNGKYU, KIM JINYOUNG, SON JANGBAE, SHIM JIHYE, SEO YOUNG KWAN
• Format: Patent
• Language: English; Japanese
• Published: 22.06.2017
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing easy formation of via holes, an insulation film made of the composition, and a printed circuit board comprising the insulation film.SOLUTION: A photosensitive resin composition comprises: a binder having alkali developable...