PHOTOSENSITIVE RESIN COMPOSITION, INSULATION FILM MADE OF THAT COMPOSITION, AND PRINTED CIRCUIT BOARD COMPRISING THAT INSULATION FILM

• Main Authors: KANG JUNGKYU, KIM JINYOUNG, SON JANGBAE, SHIM JIHYE, SEO YOUNG KWAN
• Format: Patent
• Language: English; Japanese
• Published: 22.06.2017
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing easy formation of via holes, an insulation film made of the composition, and a printed circuit board comprising the insulation film.SOLUTION: A photosensitive resin composition comprises: a binder having alkali developable and photocurable functional groups; a photopolymerizable monomer; a thermosetting epoxy resin; silica; a photoinitiator; and a curing catalyst. After curing and surface roughening treatment, the number of silica particles exposed to a surface of 5×5 μmis from 10 to 50.SELECTED DRAWING: None 【課題】ビアホールを形成することが容易な感光性樹脂組成物、この組成物で製造された絶縁フィルム及びその絶縁フィルムを備えたプリント回路基板の提供。【解決手段】アルカリ現像性及び光硬化性官能基を有するバインダーと、光重合性単量体と、熱硬化性エポキシ樹脂と、シリカと、光重合開始剤と、硬化触媒と、を含み、硬化及び表面粗化処理後に、５×５μｍ２の表面に露出するシリカの数が１０〜５０個である感光性樹脂組成物。【選択図】なし