POLYMER, ORGANIC LAYER COMPOSITION, AND METHOD OF FORMING PATTERNS

PROBLEM TO BE SOLVED: To provide a polymer having satisfactory heat resistance and etch resistance while ensuring gap-fill characteristics and planarization characteristics, an organic layer composition comprising the polymer, and a method of forming patterns using the organic layer composition.SOLU...

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Bibliographic Details
Main Authors PARK YOUJUNG, JEONG SEULGI, KIM SUNGHWAN, KIM MIN SU, NAM YOUNHEE
Format Patent
LanguageEnglish
Japanese
Published 22.06.2017
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Summary:PROBLEM TO BE SOLVED: To provide a polymer having satisfactory heat resistance and etch resistance while ensuring gap-fill characteristics and planarization characteristics, an organic layer composition comprising the polymer, and a method of forming patterns using the organic layer composition.SOLUTION: A polymer includes a structural unit represented by chemical formula 1 in the figure, where the definition of the symbols is the same as that in the specification.SELECTED DRAWING: Figure 1 【課題】本発明は、ギャップフィル特性および平坦化特性を確保しながら、耐熱性および耐エッチング性も満足することができる重合体、前記重合体を含む有機膜組成物、および前記有機膜組成物を用いたパターン形成方法を提供する。【解決手段】本発明の一実施形態に係る重合体は、下記の化学式1で表される構造単位を含む。(前記化学式1の定義は、明細書中の定義と同様である。)【選択図】図1
Bibliography:Application Number: JP20160244691