ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

• Main Author: SHIMIZU KOZO
• Format: Patent
• Language: English; Japanese
• Published: 15.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To enhance reliability by enhancing the strength of a joint part between electronic components.SOLUTION: An electronic device 1 includes: an electronic component 10 provided with an electrode 11; an electronic component 20 provided with an electrode 21 facing the electrode 11; and a joint part 30 joining the electrode 11 and the electrode 21. The joint part 30 comprises a portion 31 provided on a surface of the electrode 11, a portion 32 provided on a surface of the electrode 21, and a portion 33 provided between the portion 31 and the portion 32. The portion 31 contains a first solder having a first melting point. The portion 32 contains a second solder having a second melting point lower than the first melting point. The portion 33 contains a third solder containing respective components of the first solder and the second solder. The joint part 30 comprising the portion 31, the portion 32, and the portion 33 has a spherical outer shape.SELECTED DRAWING: Figure 6 【課題】電子部品間の接合部の強度を高め、信頼性を高める。【解決手段】電子装置１は、電極１１を備える電子部品１０と、その電極１１と対向する電極２１を備える電子部品２０と、電極１１と電極２１を接合する接合部３０とを含む。接合部３０は、電極１１の表面に設けられた部位３１と、電極２１の表面に設けられた部位３２と、部位３１と部位３２の間に設けられた部位３３とを備える。部位３１は、第１融点を有する第１半田を含む。部位３２は、第１融点よりも低い第２融点を有する第２半田を含む。部位３３は、第１半田と第２半田の互いの成分を含有する第３半田を含む。部位３１、部位３２及び部位３３を備える接合部３０は、球状の外形を有する。【選択図】図６