WAFER LEVEL PACKAGE DEVICE

• Main Authors: IWAKI TAKAO, GOTO KATSUAKI
• Format: Patent
• Language: English; Japanese
• Published: 15.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GYROSCOPIC INSTRUMENTS; MEASURING; MEASURING DISTANCES, LEVELS OR BEARINGS; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; NAVIGATION; PERFORMING OPERATIONS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY; PHYSICS; SEMICONDUCTOR DEVICES; SURVEYING; TESTING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a wafer-level package (WLP) device with which it is possible to electrically connect the reverse side of a substrate and the outside.SOLUTION: The wafer-level package device includes a TSV 10d that penetrates a sensor substrate 10 from surface to the reverse side, and a TSV 13f that also penetrates a cap layer 13 from surface to the reverse side, two of these being connected for connection to a control electrode 50a. Thus, in an angular speed sensor device having a WLP structure, the control electrode 50a arranged on the reverse side 10a of the sensor substrate 10 and the outside can be electrically connected from the cap layer 13 side. So, the reverse side 10a of the sensor substrate 10 and the outside can be electrically connected without, for example, extending an end of the sensor substrate 10 to an end of the cap layer 13, or without shifting the ends of the cap layer 13, sensor substrate 10, and support substrate 11 so as to extend an end of the support substrate 11 to an end of the sensor substrate 10.SELECTED DRAWING: Figure 2 【課題】基板の裏面側と外部との電気的接続を行うことが可能なウェハレベルパッケージ（ＷＬＰ）装置を提供する。【解決手段】センサ基板１０に対して表裏を貫通するＴＳＶ１０ｄを備えると共にキャップ層１３にも表裏を貫通するＴＳＶ１３ｆを備え、これらを接続することで制御電極５０ａに接続されるようにする。これにより、ＷＬＰ構造を有する角速度センサ装置において、センサ基板１０の裏面１０ａ側に配置された制御電極５０ａと外部との電気的接続をキャップ層１３側から行える。そして、キャップ層１３の端部に対してセンサ基板１０の端部を張り出させたり、センサ基板１０の端部に対して支持基板１１の端部を張り出させるように、キャップ層１３とセンサ基板１０および支持基板１１の端部をずらさなくても、センサ基板１０の裏面１０ａ側と外部との電気的接続が行える。【選択図】図２