COOLING DEVICE

• Main Authors: HUANG RONG TAN, MOCHIZUKI MASATAKA, AHAMED MOHAMMAD SHAHED, SAITO YUJI
• Format: Patent
• Language: English; Japanese
• Published: 15.06.2017
• Subjects: BLASTING; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS; WEAPONS

PROBLEM TO BE SOLVED: To provide a cooling device which can more effectively dissipate heat generated in electronic components built in an electronic device and contributes to the miniaturization of the electronic device.SOLUTION: The cooling device includes: a piezo fan which includes two diaphragms respectively having first to fourth marginal parts extending along first to fourth sides and respectively comprising a piezoelectric element, and a spacer connecting the first to third edge parts of the two diaphragms; and a heat pipe which is disposed on at least one surface of the two diaphragms so as to be in thermal contact with at least one of the first to third marginal parts.SELECTED DRAWING: Figure 3 【課題】電子デバイスに内蔵される電子部品で発生する熱をより効果的に消散させることができ、且つ、電子デバイスの小型化に寄与する冷却装置を提供とする。【解決手段】第一から第四の辺に沿って延在する第一から第四の辺縁部をそれぞれ有し、圧電素子をそれぞれ備える二つの振動板と、前記二つの振動板の第一から第三の辺縁部同士を接続するスペーサと、を備えるピエゾファンと、前記二つの振動板のうちの少なくとも一方の表面であって前記第一から第三の辺縁部の少なくとも一つに熱的に接触するように配されたヒートパイプと、を備える冷却装置。【選択図】図３