SEMICONDUCTOR DEVICE

• Main Authors: MATSUMURA HITOTSUGU, KOTANI KAZUYA, ICHIKURA YUTA, IIO HISATAKA, TAKENAKA HIROSHI, TSUNEOKA OSAMU
• Format: Patent
• Language: English; Japanese
• Published: 08.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of outputting a large current with a high level of safety.SOLUTION: A semiconductor device according to an embodiment includes: a first conductor; a semiconductor chip one surface of which has a first electrode and the other surface of which has a second electrode; a conductive first joint material that is provided between the first conductor and first electrode; a second conductor that includes a first part having a first surface and a second part having a second surface which is provided between the first part and semiconductor chip and whose area is narrower than the area of the first surface; a conductive second joint material that is provided between the second electrode and second surface; and a resin member that is provided so as to cover at least a peripheral edge part of the semiconductor chip.SELECTED DRAWING: Figure 2 【課題】安全性が高い大電流出力が可能な半導体装置を提供する。【解決手段】実施形態に係る半導体装置は、第１導体と、一方の面に第１電極を有し、他方の面に第２電極を有する半導体チップと、前記第１導体と前記第１電極との間に設けられた導電性の第１接合材と、第１面を有する第１部分と、前記第１部分と半導体チップとの間に設けられ前記第１面の面積よりも狭い面積の第２面を有する第２部分と、を有する第２導体と、前記第２電極と前記第２面との間に設けられた導電性の第２接合材と、前記半導体チップの少なくとも周縁部を覆うように設けられた樹脂部材と、を備える。【選択図】図２