POWER CONVERSION DEVICE

PROBLEM TO BE SOLVED: To provide a power conversion device which efficiently cools a plurality of semiconductor modules connected in parallel while disposing the semiconductor modules closely.SOLUTION: A power conversion device comprises: a plurality of heating elements (power modules 700), each hea...

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Bibliographic Details
Main Authors ICHIKAWA TOMOKAZU, MATSUMOTO DAISUKE, KAMITSUMA HIROSHI, SHIRAKAWA SHINJI
Format Patent
LanguageEnglish
Japanese
Published 08.06.2017
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Summary:PROBLEM TO BE SOLVED: To provide a power conversion device which efficiently cools a plurality of semiconductor modules connected in parallel while disposing the semiconductor modules closely.SOLUTION: A power conversion device comprises: a plurality of heating elements (power modules 700), each heating element including opposite two planes and at least one of the two planes including a cooling surface; and a heat receiving block 601 with which a plurality of insertion ports are formed for inserting the plurality of heating elements. In the heat receiving block, a region where the insertion port is not formed includes: a non-shared cooling part for receiving heat from one cooling surface of one of the plurality of heating elements; and a shared cooling part which is a region held between neighboring insertion ports among the plurality of insertion ports and receives heat from each of the neighboring heating elements. The quantity of heat to be received from the heating elements in the shared cooling part is more than the quantity of heat to be received from the heating element in the non-shaped cooling part.SELECTED DRAWING: Figure 7 【課題】複数の並列接続する半導体モジュールを近くに配置しつつ、効率的に冷却する電力変換装置を提供する。【解決手段】対向する二平面を有し、二平面の少なくとも一平面は冷却面を有する複数の発熱体(パワーモジュール700)と、複数の発熱体をそれぞれ挿入するための挿入口が複数形成されている受熱ブロック601と、を有する。受熱ブロックのうち挿入口が形成されていない領域は、複数の発熱体のうち一の発熱体の一つの冷却面から熱を受ける非共有冷却部と、複数の挿入口のうち隣り合う挿入口に挟まれる領域であって、隣り合う発熱体のそれぞれから熱を受ける共有冷却部と、を備える。共有冷却部における発熱体からの受熱量は、非共有冷却部における発熱体からの受熱量よりも大きい。【選択図】図7
Bibliography:Application Number: JP20150232593