OPTICAL MODULATOR MODULE

PROBLEM TO BE SOLVED: To provide an optical modulator module, which has an optical modulator integration semiconductor laser, a signal line for transmitting a high frequency signal, and a termination resistor mounted on a board, capable of satisfying the requirements of preventing degradation of fre...

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Bibliographic Details
Main Authors KAMO YOSHIYUKI, MORITA YOSHIMICHI
Format Patent
LanguageEnglish
Japanese
Published 08.06.2017
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Summary:PROBLEM TO BE SOLVED: To provide an optical modulator module, which has an optical modulator integration semiconductor laser, a signal line for transmitting a high frequency signal, and a termination resistor mounted on a board, capable of satisfying the requirements of preventing degradation of frequency bandwidth due to increase of pad area while reducing the size of the optical modulator module.SOLUTION: An optical modulator module 1 can be reduced in size by disposing a signal line 6 and a termination resistor 8 at the same side with respect to a direction in which a waveguide of an optical modulator 4 extends. A wire 11(a) and a wire 11(b) are fixed to a bonding pad 10 of the optical modulator 4 being overlapped with each other. Therefore, the frequency bandwidth is ensured without expanding the pad area.SELECTED DRAWING: Figure 1 【課題】光変調器集積半導体レーザ、高周波信号を伝送するための信号線路、および終端抵抗を基板上に実装した光変調器モジュールにおいて、光変調器モジュールの小型化とパッド面積拡大による周波数帯域劣化の回避を同時に満足する。【解決手段】光変調器4の導波路延伸方向に対して、信号線路6と終端抵抗8とを、同じ側に配置することにより、光変調器モジュール1を小型化できる。光変調器4のボンディングパッド10にワイヤ11(a)とワイヤ11(b)を重ねて打つので、パッド面積を拡大する必要がなく周波数帯域を維持できる。【選択図】図1
Bibliography:Application Number: JP20150234932