PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photocurable and thermosetting resin composition which has both excellent photocurability and excellent thermosetting property, when the composition is irradiated with light under such a condition that a portion not irradiated with light occurs, the composition is...

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Bibliographic Details
Main Authors TAMURA MASARU, FURUTA KIYOTAKA, KURONUSHI SHOJI, OGINO KEIJI
Format Patent
LanguageEnglish
Japanese
Published 08.06.2017
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Summary:PROBLEM TO BE SOLVED: To provide a photocurable and thermosetting resin composition which has both excellent photocurability and excellent thermosetting property, when the composition is irradiated with light under such a condition that a portion not irradiated with light occurs, the composition is heated to completely cure the whole composition containing the portion not irradiated with light and to produce a cured product having a high adhesive strength, and has good storage stability.SOLUTION: A resin composition contains (1) a compound having a (meth)acryloyl group, (2) a polyene compound having two or more vinyl groups and aryl groups in one molecule, (3) a polythiol compound having two or more thiol groups in one molecule, (4) a photoradical generator, (5) a thermal radical generator, and (6) a thermal anionic polymerization initiator.SELECTED DRAWING: None 【課題】優れた光硬化性と優れた熱硬化性を併せ持ち、光照射が光未照射部分を生じるような条件下でなされた場合には、その後に加熱することで、該光未照射部分を含む組成物全体が完全に硬化して高接着強度の硬化物を生成し得、しかも、保存安定性も良好な、光および熱硬化性樹脂組成物の提供。【解決手段】(1)(メタ)アクリロイル基を有する化合物、(2)1分子中にビニル基又はアリル基を2個以上有するポリエン化合物、(3)1分子中にチオール基を2個以上有するポリチオール化合物、(4)光ラジカル発生剤、(5)熱ラジカル発生剤、及び(6)熱アニオン重合開始剤を含む、樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20150233313