RESIN COMPOSITION AND RESIN MOLDED BODY

PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat resistance and hardly reducing the heat resistance with time and a resin molded body obtained by molding the resin composition.SOLUTION: There are provided a resin composition which contains at least an alicyclic structure-contai...

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Bibliographic Details
Main Author SAWAGUCHI TAICHI
Format Patent
LanguageEnglish
Japanese
Published 08.06.2017
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat resistance and hardly reducing the heat resistance with time and a resin molded body obtained by molding the resin composition.SOLUTION: There are provided a resin composition which contains at least an alicyclic structure-containing polymer and a heat resistance improver, where the heat resistance improver consists of one or more kind of ionic compounds selected from a group consisting of lithium perchlorate, sodium perchlorate, potassium perchlorate, magnesium perchlorate, lithium trifluoromethanesulfonate, lithium bis(trifluoromethansulfonyl)imide, sodium bis(trifluoromethansulfonyl)imide, potassium bis(trifluoromethansulfonyl)imide, lithium tris(trifluoromethansulfonyl)methide and sodium tris(trifluoromethansulfonyl)methide and moisture content is 1 wt.% or less based on total of the alicyclic structure-containing polymer and the heat resistance improver, and a resin molded body obtained by molding the resin composition.SELECTED DRAWING: None 【課題】耐熱性に優れ、かつ、耐熱性が経時的に低下し難い樹脂組成物、及びこの樹脂組成物を成形して得られる樹脂成形体を提供する。【解決手段】少なくとも脂環構造含有重合体と耐熱性向上剤とを含有し、水分を含有していてもよい樹脂組成物であって、前記耐熱性向上剤が、過塩素酸リチウム、過塩素酸ナトリウム、過塩素酸カリウム、過塩素酸マグネシウム、トリフルオロメタンスルホン酸リチウム、リチウムビス(トリフルオロメタンスルホニル)イミド、ナトリウムビス(トリフルオロメタンスルホニル)イミド、カリウムビス(トリフルオロメタンスルホニル)イミド、リチウムトリス(トリフルオロメタンスルホニル)メチド、及びナトリウムトリス(トリフルオロメタンスルホニル)メチドからなる群から選ばれるイオン性化合物の1種又は2種以上からなるものであり、水分含有量が、脂環構造含有重合体と耐熱性向上剤の合計に対して1重量%以下である樹脂組成物、及び、この樹脂組成物を成形して得られる樹脂成形体。【選択図】 なし
Bibliography:Application Number: JP20150232783