PRINT CIRCUIT BOARD, ELECTRIC POWER SUPPLY, LIGHTING FITTING, AND MANUFACTURING METHOD OF ELECTRIC POWER SUPPLY

• Main Authors: HORI KAZUTAKA, YAMADA ERIKO, MOROKUMA MANABU
• Format: Patent
• Language: English; Japanese
• Published: 01.06.2017
• Subjects: BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; NON-PORTABLE LIGHTING DEVICES; PRINTED CIRCUITS; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

PROBLEM TO BE SOLVED: To suppress occurrence of a bridge.SOLUTION: A dummy pad 12 of a print circuit board 1 is formed in a pentagonal shape having a hypotenuse 120. Therefore, an extract molten solder attached between leads 241 is flowed to a diagonally rear direction along with the hypotenuse 120 of the dummy pad 12. Thus, since a force of the diagonally rear direction is applied to the molten solder W attached to near a root of each of the leads 241, the molten solder is easily separated from the root of each lead 241. As a result, occurrence of a bridge is further suppressed in the print circuit board 1 compared to the case where the hypotenuse is not provided to the dummy pad 13.SELECTED DRAWING: Figure 4 【課題】ブリッジの発生をさらに抑制する。【解決手段】プリント配線板１のダミーパッド１２は、斜辺１２０を有する５角形状に形成されている。ゆえに、リード２４１間に付着した余分な溶融はんだは、ダミーパッド１２の斜辺１２０に沿って、斜め後ろ向きに流れる。そのため、リード２４１の根本付近に付着した溶融はんだＷに斜め後ろ向きの力が加わるので、リード２４１の根元から引き離され易くなる。その結果、プリント配線板１は、ダミーパッド１３に斜辺が設けられていない場合と比較して、ブリッジの発生をさらに抑制することができる。【選択図】 図４