FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

• Main Authors: JEONG SUNG WON, AHN HA YOUNG, KOOK SEUNG YEOP, KIM SUNG HO, SEO SHANG HOON, KIM JI HOON
• Format: Patent
• Language: English; Japanese
• Published: 25.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a fan-out semiconductor package and an electronic device including the same.SOLUTION: The present invention relates to a fan-out semiconductor package and an electronic device including the same. The fan-out semiconductor package includes: a first interconnection member including a first insulating layer, first and second pads respectively disposed on both sides of the first insulating layer and a first via connecting the first and second pads to each other; an electronic component disposed on the first interconnection member; and an encapsulant encapsulating the electronic component. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.SELECTED DRAWING: Figure 4 【課題】本発明は、ファンアウト半導体パッケージ及びそれを含む電子機器に関する。【解決手段】本発明は、第１絶縁層、上記第１絶縁層の両側にそれぞれ配置された第１パッドと第２パッド、及び上記第１パッドと第２パッドとを接続する第１ビアを含む第１接続部材と、上記第１接続部材上に配置された電子部品と、上記電子部品を封止する封止材と、を含み、上記第１ビアの中心線の配置は、上記第１パッドの中心線の配置及び上記第２パッドの中心線の配置の少なくとも一つと異なる配置である、ファンアウト半導体パッケージ及びそれを含む電子機器に関する。【選択図】図４