LEAD FRAME SUBSTRATE WITH RESIN

• Main Author: MANIWA SUSUMU
• Format: Patent
• Language: English; Japanese
• Published: 25.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a lead frame substrate with resin which shows an excellent connection strength with respect to a bonding wire.SOLUTION: The lead frame substrate with resin includes: a lead frame obtained by forming a predetermined wiring pattern including a die pad for mounting an element and an electrode pad for electrical conduction with the element by removing a metallic plate partially or entirely in a thickness direction; and an insulation resin that fills a portion from which a metal has been removed, in the lead frame. On one face of the die pad at the same side as a side where the element is mounted, a roughness of a surface of a lead ranges from 1 μm or more to 5 μm or less in a Rz (ten point average roughness).SELECTED DRAWING: Figure 2 【課題】ボンディングワイヤに対して、良好な接続強度を示す樹脂付リードフレーム基板を提供すること。【解決手段】樹脂付リードフレーム基板は、金属平板を厚み方向に、一部もしくは全てを除去して、素子を搭載するダイパッド及び素子と電気的導通をとるための電極パッドを含む所定の配線パターンを形成することによって得られるリードフレームと、リードフレームの金属を除去した部分を埋める絶縁樹脂とを含み、ダイパッドの素子を搭載する側と同じ片面においてリードの表面の粗度が、Ｒｚ（十点平均粗さ）において、１μｍ以上５μｍ以下の範囲にある。【選択図】図２