ASSEMBLED CONDITION DIAGNOSIS DEVICE

• Main Authors: GOKO MICHIHISA, SAKAIDA ATSUSUKE, TANIGUCHI TOSHIHISA, SHIRAISHI YOSHIHIKO, OKAMOTO KEIJI
• Format: Patent
• Language: English; Japanese
• Published: 25.05.2017
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING; TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR

PROBLEM TO BE SOLVED: To provide an assembled condition diagnosis device capable of diagnosing whether assembled condition of assembly parts is appropriate or not.SOLUTION: A diagnosis device 1 is designed to diagnose assembled condition of assembly parts having sliding portions. The diagnosis device 1 includes a sensor unit 2 configured to detect a thermal flux flowing from the sliding portions toward outside, and a control unit 3 configured to determine whether assembled condition of the assembled parts is appropriate or not based on a result of detection by the sensor unit 2. Magnitude of the thermal flux from the sliding portions associated with appropriate assembled condition of the assembly parts with sliding portions is different from that associated with inappropriate assembled condition. The diagnosis device 1 is thus capable of diagnosing whether the assembled condition of the assembly parts is appropriate or not.SELECTED DRAWING: Figure 1 【課題】組付部品の組付状態が適正か否かを診断できる組付状態の診断装置を提供する。【解決手段】診断装置１は、摺動部を有する組付部品の組付状態を診断する。診断装置１は、摺動部から外部に向かって流れる熱流束を検出するセンサ部２と、センサ部２が検出した検出結果に基づいて、組付部品の組付状態が適正か否かを判定する制御装置３とを備える。摺動部を有する組付部品の組付状態が適正のときと不適正のときでは、摺動部からの熱流束の大きさが異なる。このため、診断装置１によれば、組付部品の組付状態が適正か否かを診断できる。【選択図】図１