POLYCARBOXYLIC ACID RESIN AND POLYCARBOXYLIC ACID RESIN COMPOSITION COMPRISING THE SAME, EPOXY RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND SEMICONDUCTOR DEVICE

• Main Authors: TANIGUCHI NAOSUKE, TATENO MASAKI, MIYAGAWA NAOFUSA, SASAKI TOMOE
• Format: Patent
• Language: English; Japanese
• Published: 25.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a polycarboxylic acid resin that has a low refractive index and high sulfur resistance, from which a cured product of high transparency can be obtained.SOLUTION: The present invention provides a polycarboxylic acid resin represented by formula (1) (Xis a C1-20 divalent or trivalent organic group or a bond between T and O; if Xis the divalent organic group or the bond between T and O, m is 1, and if Xis the trivalent organic group, m is 2; Xis a C1-20 divalent organic group; T is a Si2-10 chain, branched, or cyclic siloxane skeleton which may have C, H, or N; n is an integer of 2-4).SELECTED DRAWING: Figure 1 【課題】硬化物の透明性が高く、低屈折率、高い耐硫化性の多価カルボン酸樹脂の提供。【解決手段】式（１）で表される多価カルボン酸樹脂。（Ｘ１はＣ１〜２０の２価或いは３価の有機基又はＴとＯの結合；Ｘ１が２価又はＴとＯの結合のときｍは１、Ｘ１が３価のときｍは２；Ｘ２はＣ１〜２０の２価の有機基；ＴはＣ、Ｈ、Ｎを含んでいてもよいＳｉ２〜１０の鎖状、分岐状、環状のシロキサン骨格；nは２〜４整数）【選択図】図１