METAL PLATE FOR CIRCUIT BOARD, METAL PLATE MOLDING FOR CIRCUIT BOARD, CIRCUIT BOARD, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE

PROBLEM TO BE SOLVED: To provide: a metal plate for a circuit board capable of easily manufacturing a circuit board while securing required insulation properties by patterning, regardless of the magnitude of the thicknesses of a metal plate for a circuit board; a metal plate molding for a circuit bo...

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Bibliographic Details
Main Authors WAKAMATSU MOTOKI, YOKOYAMA MASAHIKO, KOMATSU KOZO, HIRAYAMA SUMIO
Format Patent
LanguageEnglish
Japanese
Published 18.05.2017
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide: a metal plate for a circuit board capable of easily manufacturing a circuit board while securing required insulation properties by patterning, regardless of the magnitude of the thicknesses of a metal plate for a circuit board; a metal plate molding for a circuit board; a circuit board; a power module; and a method for manufacturing a power module.SOLUTION: A metal plate 1 for a circuit board of the present invention is formed by press molding.SELECTED DRAWING: Figure 1 【課題】回路基板用金属板の厚みの大小によらず、パターニングによる所要の絶縁性を確保しつつ、回路基板を容易に製造することのできる回路基板用金属板、回路基板用金属板成形品、回路基板およびパワーモジュール、ならびに、パワーモジュールの製造方法を提供する。【解決手段】この発明の回路基板用金属板１は、プレス成形により形成されてなるものである。【選択図】図１
Bibliography:Application Number: JP20160209778