METHOD OF MANUFACTURING PRIMARY MOUNTING SEMICONDUCTOR DEVICE

• Main Authors: SHIGA GOSHI, IINO CHIE
• Format: Patent
• Language: English; Japanese
• Published: 18.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a bump base reinforcement primary mounting semiconductor device, capable of reinforcing the base on the primary mounting board side, even of a large diameter solder bump.SOLUTION: A method of manufacturing a bump base reinforcement primary mounting semiconductor device includes step A of preparing a reinforcement sheet including a base material sheet and a thermosetting resin sheet laminated thereon, step B of preparing a primary mounting semiconductor device where solder bumps are formed on the first principal surface, step C of pasting the thermosetting resin sheet of the reinforcement sheet to the first principal surface of the primary mounting semiconductor device by hot press, while exposing the solder bump from the thermosetting resin sheet, step D of exfoliating the thermosetting resin sheet and base material sheet in the reinforcement sheet, following to the step C, thus obtaining a primary mounting semiconductor device with the thermosetting resin sheet, and step E of performing heat treatment of the thermosetting resin sheet, following to the step D.SELECTED DRAWING: Figure 2A 【課題】 大径化させた半田バンプでも一次実装基板側の根元部分を補強可能であるバンプ根元補強型の一次実装半導体装置の製造方法を提供すること。【解決手段】 基材シートと該基材シート上に積層された熱硬化性樹脂シートとを備える補強用シートを準備する工程Ａ、第１主面に半田バンプが形成された一次実装半導体装置を準備する工程Ｂ、前記一次実装半導体装置の第１主面に前記補強用シートの熱硬化性樹脂シートを、前記熱硬化性樹脂シートから前記半田バンプを露出させながら加熱加圧下にて貼り合わせる工程Ｃ、前記工程Ｃの後、前記補強用シートにおける熱硬化性樹脂シートと基材シートとを剥離して前記熱硬化性樹脂シート付きの一次実装半導体装置を得る工程Ｄ、及び前記工程Ｄの後、前記熱硬化性樹脂シートを加熱処理する工程Ｅを含むバンプ根元補強型の一次実装半導体装置の製造方法。【選択図】 図２Ａ