FILM MOLD AND IMPRINT METHOD

• Main Authors: OKAWA YASUO, YOSHIOKA HIDENORI
• Format: Patent
• Language: English; Japanese
• Published: 18.05.2017
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a film mold which transfers a pattern having good position accuracy to a molded material.SOLUTION: A film mold 1 according to one embodiment includes: a first resin layer 11 having a pattern area 11P including an uneven pattern and formed by a resin composition; and a first glass substrate layer 12 laminated on a surface of the first resin layer 11 which is opposite to a surface, on which the pattern area 11P is formed, and formed by thin-film glass.SELECTED DRAWING: Figure 1 【課題】被成形材料に対して良好な位置精度のパターンを転写することができるフィルムモールドを提供する。【解決手段】本実施の形態に係るフィルムモールド１は、凹凸パターンを含むパターン領域１１Ｐを有し、樹脂組成物から構成される第１樹脂層１１と、第１樹脂層１１のうちのパターン領域１１Ｐが形成される面とは反対側の面に積層され、薄膜ガラスから構成される第１ガラス基板層１２と、を備える。【選択図】図１