HEAT-DISSIPATING COPPER FOIL AND GRAPHENE COMPOSITE

• Main Author: CHENG KUEI-SEN
• Format: Patent
• Language: English; Japanese
• Published: 18.05.2017
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a heat-dissipating copper foil and a graphene composite.SOLUTION: A heat dissipating copper foil is characterized in that a copper content is greater than 90%, an area weight is in the range of 280 to 900 (g/m), and the copper foil comprises a drum-side and a deposited-side, with the deposited-side having a surface roughness (Rz) of 1.0 μm or less.SELECTED DRAWING: Figure 2 【課題】放熱銅箔およびグラフェン複合材を提供する。【解決手段】銅含有量が９０％より多く、面積重量が２８０〜９００（ｇ／ｍ2）の範囲にあり、ドラム面と析出面を含む銅箔であって、前記析出面の表面粗度（Ｒｚ）が１．０μｍ以下である放熱銅箔。【選択図】図２