COPPER REMOVAL MATERIAL OF ELECTROLESS PALLADIUM PLATING LIQUID

• Main Authors: KAWACHI AKINORI, SUGAWARA KAZUTOMI, IWAMOTO YUKA, KUDO RYOKO, MORIMOTO TORU
• Format: Patent
• Language: English; Japanese
• Published: 20.04.2017
• Subjects: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEPARATION; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; THEIR RELEVANT APPARATUS; TRANSPORTING; TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

PROBLEM TO BE SOLVED: To provide a copper removal material of electroless palladium plating liquid excellent in copper removal effect in the electroless palladium plating liquid.SOLUTION: There is provided a copper removal material of electroless palladium plating liquid containing fibrous active carbon in which a pore volume in the range of 10 Å or more and 20 Å or less of a pore diameter is 0.05 cc/g or more in a pore distribution determined by MP method by a nitrogen adsorption isotherm at the temperature of 77.4 K.SELECTED DRAWING: None 【課題】無電解パラジウムめっき液中の銅除去効果に優れた、無電解パラジウムめっき液の銅除去材を提供する。【解決手段】温度７７．４Ｋにおける窒素吸着等温線によりＭＰ法で求めた細孔分布において、細孔直径１０Å以上２０Å以下の範囲の細孔容積が、０．０５ｃｃ／ｇ以上である繊維状活性炭を含む、無電解パラジウムめっき液の銅除去材。【選択図】なし