SUBSTRATE PROCESSING APPARATUS
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus comprising a sucking and inverting device which can shorten a work time until placing a substrate onto a table of the next process after inverting the same.SOLUTION: A substrate processing apparatus A comprises a scribe device B which...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
20.04.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a substrate processing apparatus comprising a sucking and inverting device which can shorten a work time until placing a substrate onto a table of the next process after inverting the same.SOLUTION: A substrate processing apparatus A comprises a scribe device B which forms scribe lines on the surface of a substrate W, and a sucking and inverting device C having a sucking part 14 which sucks and inverts the scribed substrate W and delivers the same to a reception part of the next process. The reception part is formed of plural receiving members 24 which are arranged in parallel at intervals, and the plural receiving members 24 are provided to be projectable and retractable from a table upper surface of a break device.SELECTED DRAWING: Figure 5
【課題】 基板反転後に次工程のテーブルに載置するまでの作業時間を短縮できる吸着反転装置を備えた基板加工装置を提供する。【解決手段】 基板Wの表面にスクライブラインを形成するスクライブ装置Bと、スクライブされた基板Wを吸着して反転させ、次工程の受取り部に受け渡す吸着部14を有する吸着反転装置Cとを備えた基板加工装置Aであって、受取り部は間隔をあけて平行に配置された複数の受け部材24で形成され、複数の受け部材24は、ブレイク装置のテーブル上面に出没自在に設けられている。【選択図】図5 |
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Bibliography: | Application Number: JP20160226431 |