NON-CONTACT POWER TRANSMISSION DEVICE

PROBLEM TO BE SOLVED: To resolve a problem that, in a non-contact power transmission device, in a case where a power transmission part of the non-contact power transmission device supplies AC power to a power transmission resonator by using a circuit consisting of a semiconductor switching element,...

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Bibliographic Details
Main Authors TANAKA JUNJI, TODAKA YOSHIHIRO
Format Patent
LanguageEnglish
Japanese
Published 13.04.2017
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Summary:PROBLEM TO BE SOLVED: To resolve a problem that, in a non-contact power transmission device, in a case where a power transmission part of the non-contact power transmission device supplies AC power to a power transmission resonator by using a circuit consisting of a semiconductor switching element, when a power transmission frequency of high-frequency power in to which the power transmission part transmits the power transmission resonator is accorded to a resonance frequency of the power transmission resonator, power loss at the switching element of the power transmission part becomes large.SOLUTION: A power transmission frequency of a power transmission part of a non-contact power transmission device is set to be a frequency higher than a frequency in which resonance of a power transmission resonator becomes maximum. According to this constitution, power loss at a switching element of the power transmission part can be reduced while keeping a resonance state of the power transmission resonance circuit to a high state, thereby, the non-contact power transmission device that can transmit power with small temperature rise at the switching element and with high efficiency can be provided.SELECTED DRAWING: Figure 1 【課題】非接触電力伝送装置において、非接触電力伝送装置の送電部が半導体のスイッチング素子からなる回路により送電共振器に交流電力を供給する場合に、送電部が送電共振器に供給する高周波電力の送電周波数を送電共振器の共振周波数に一致させると、送電部のスイッチング素子における電力損失が大きくなる。【解決手段】非接触電力伝送装置の送電部の送電周波数を送電共振器の共振が最大となる周波数よりも高い周波数に設定する。この構成によれば、送電共振回路の共振状態を高い状態に保ちつつ、送電部のスイッチング素子における電力損失を小さくすることが可能となるので、スイッチング素子における温度上昇が小さく高効率で電力伝送が可能な非接触電力伝送装置を提供することができる。【選択図】図1
Bibliography:Application Number: JP20170011796