WIRING BOARD AND MANUFACTURING METHOD THEREFOR

• Main Authors: IIJIMA KAZUHIKO, YONEMURA KOJI, ABE KENICHIRO, OKA SHUICHI, FUKUI KEI, ARAI KAZUYA, ROKUHARA MASAHITO
• Format: Patent
• Language: English; Japanese
• Published: 13.04.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board including a thin dielectric layer and a manufacturing method therefor.SOLUTION: A manufacturing method for a wiring board includes the steps of: patterning a first conductor layer 2 in a laminated sheet 1 to form a first conductor pattern 2a, the laminated sheet including the first conductor layer 2, an inorganic dielectric layer 3 and a second conductor layer 4 laminated therein in order; sticking a first conductor pattern 2a side of the laminated sheet 1 to a resin layer 16 that is provided on a surface of a support substrate 15; after sticking the laminated sheet 1, patterning the second conductor layer 4 of the laminated sheet 1 to form a second conductor pattern 4a; and, after forming the second conductor pattern 4a, separating the laminated sheet 1 from the support substrate 15.SELECTED DRAWING: Figure 15 【課題】薄い誘電体層を備えた配線基板とその製造方法を提供すること。【解決手段】第１の導体層２、無機誘電体層３、及び第２の導体層４が順に積層された積層シート１のうち、第１の導体層２をパターニングして第１の導体パターン２ａにする工程と、支持基板１５の表面に設けられた樹脂層１６に、積層シート１の第１の導体パターン２ａ側を貼付する工程と、積層シート１を貼付した後、積層シート１の第２の導体層４をパターニングして第２の導体パターン４ａにする工程と、第２の導体パターン４ａを形成した後、支持基板１５から積層シート１を剥離する工程とを有する配線基板の製造方法による。【選択図】図１５