METHOD OF MANUFACTURING SEMICONDUCTIVE ROLLER

PROBLEM TO BE SOLVED: To provide a manufacturing method that enables a semiconductive roller to be manufactured with higher productivity than now by eliminating a step of inserting a temporary core causing a trouble.SOLUTION: An uncrosslinked cylindrical body 13, from which a semiconductive roller i...

Full description

Saved in:
Bibliographic Details
Main Author TANIO YUSUKE
Format Patent
LanguageEnglish
Japanese
Published 13.04.2017
Subjects
BEARINGS
BLASTING
CINEMATOGRAPHY
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
ELEMENTS OR CRANKSHAFT MECHANISMS
ENGINEERING ELEMENTS AND UNITS
FLEXIBLE SHAFTS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
HOLOGRAPHY
LIGHTING
MAGNETOGRAPHY
MECHANICAL ENGINEERING
PHOTOGRAPHY
PHYSICS
ROTARY BODIES OTHER THAN GEARING ELEMENTS
SHAFTS
THERMAL INSULATION IN GENERAL
WEAPONS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method that enables a semiconductive roller to be manufactured with higher productivity than now by eliminating a step of inserting a temporary core causing a trouble.SOLUTION: An uncrosslinked cylindrical body 13, from which a semiconductive roller is made, is crosslinked by being heated within a vulcanizer in the state of being housed in a linear storage groove 8 making a cross-section of an inner bottom surface 7 assume a concavely-curved shape like an arc with a diameter R1.05-2.6 times larger than a diameter Rof the cylindrical body.SELECTED DRAWING: Figure 1 【課題】トラブルの原因となる仮芯の挿通工程を無くして、現状よりも高い生産性でもって半導電性ローラを製造できる製造方法を提供する。【解決手段】半導電性ローラのもとになる未架橋の筒状体１３を、内底面７の断面形状が上記筒状体の半径Ｒ２の１．０５倍以上、２．６倍以下の半径Ｒ１を有する円弧状の凹曲面とされた、直線状の収容溝８内に収容した状態で、加硫缶内で加熱して架橋させる。【選択図】図１
Bibliography:Application Number: JP20150197759