METHOD FOR MANUFACTURING LIQUID EJECTING HEAD

• Main Author: NAKAYAMA HITOSHI
• Format: Patent
• Language: English; Japanese
• Published: 13.04.2017
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid ejecting head in which an appropriate amount of a plating catalyst is made to adhere to the surface of a piezoelectric substrate and a conductor film deposited by electroless plating is homogenized to improve adhesion strength.SOLUTION: A method for manufacturing a liquid ejecting head includes: a photosensitive resin layer forming step of placing a photosensitive resin layer 2 on the surface of a polarized piezoelectric substrate 1; a groove forming step of forming grooves 3 in the surface of the piezoelectric substrate 1; a coupling treatment step of attaching a coupling agent to the exposed surfaces S of the piezoelectric substrate 1; a catalyst attaching step of attaching a plating catalyst to the exposed surfaces S to which the coupling agent has been attached; an electroless plating step of forming a conductor film 4 on the exposed surfaces S, to which the plating catalyst has been attached, by electroless plating; and a lift-off step of removing the photosensitive resin layer 2 from the piezoelectric substrate 1 to form a pattern of the conductor film 4.SELECTED DRAWING: Figure 2 【課題】圧電体基板の表面に適量のメッキ触媒を付着させ、無電解メッキにより析出する導体膜を均質化し密着強度を向上させる液体噴射ヘッドの製造方法を提供する。【解決手段】分極した圧電体基板１の表面に感光性樹脂層２を設置する感光性樹脂層形成工程と、圧電体基板１の表面に溝３を形成する溝形成工程と、圧電体基板１の露出面Ｓにカップリング剤を付着させるカップリング処理工程と、カップリング剤が付着した露出面Ｓにメッキ触媒を付着させる触媒付着工程と、メッキ触媒が付着した露出面Ｓに無電解メッキにより導体膜４を形成する無電解メッキ工程と、感光性樹脂層２を圧電体基板１から除去して導体膜４のパターンを形成するリフトオフ工程と、を備える。【選択図】図２