WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

• Main Authors: KITO MASANORI, YOSHIMURA KOHEI, FUKUNAGA KAZUNORI, MIZOGUCHI KEN, MIZUNO HIDEYA
• Format: Patent
• Language: English; Japanese
• Published: 23.03.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board which can radiate heat of an element to the outside efficiently even when the mounted element has a comparatively high calorific value, and which can ensure normal performance of each element, and which enables successful and efficient mounting of the element, and which has a ceramic substrate body having high physical strength; and provide a manufacturing method of the wiring board.SOLUTION: A wiring board 1a comprises: a ceramic substrate body 2 having a surface 3 and a rear face 4; a plurality of element mounting pads 16 which are formed on the surface 3 side of the ceramic substrate body 2 and composed of copper; a plurality of connection terminals 17 which are formed on the rear face 4 side of the ceramic substrate body 2 and composed of copper; and via conductors 18 for individually connecting the plurality of element mounting pads 16 and the plurality of connection terminals 17. The element mounting pads 16 and the connection terminals 17 are copper layers and the via conductor 18 is silver solder.SELECTED DRAWING: Figure 2 【課題】発熱量の比較的大きな素子を搭載しても、該素子の熱を効率良く外部に放熱して、該素子ごとの本来の性能を確保し得ると共に、前記素子を精度良く確実に搭載でき、且つ物理的強度の高いセラミック基板本体を有する配線基板、およびその製造方法を提供する。【解決手段】表面３および裏面４を有するセラミック基板本体２と、該セラミック基板本体２の表面３側に形成された銅からなる複数の素子搭載用パッド１６と、上記セラミック基板本体２の裏面４側に形成された銅からなる複数の接続端子１７と、上記複数の素子搭載用パッド１６と複数の接続端子１７との間を個別に接続するビア導体１８と、を備えた配線基板１ａであって、上記素子搭載用パッド１６と接続端子１７とは、銅層であり、上記ビア導体１８は、銀ロウである、配線基板１ａ。【選択図】 図２