SEMICONDUCTOR DEVICE

• Main Authors: KOSAKA YOSHIYUKI, OYAMA KATSUHIKO, FUJIMAKI AKIKO, SATO HIROTAKA, TSUKIYAMA KEISHI, MUKODA HIDEKO
• Format: Patent
• Language: English; Japanese
• Published: 23.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING RECORD CARRIERS; LINE CONNECTORS; PHYSICS; PRESENTATION OF DATA; RECOGNITION OF DATA; RECORD CARRIERS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent the occurrence of poor connection between a plug and a circuit board.SOLUTION: A semiconductor device comprises a circuit board, a plug, and a second enclosure. The circuit board comprises: a wiring board having a plurality of connection pads including a first connection pad; and a semiconductor chip mounted on the wiring board. The plug comprises: a first enclosure comprising an enclosure part having outer peripheral surfaces including a first surface and a second surface located opposite the first surface, a hollow part surrounded with the outer peripheral surfaces, and a projection extending from the enclosure part in a direction different from the direction of the first surface or the second surface; and a connection terminal which extends outward from the inside of the hollow part and is electrically connected to the first connection pad. The second enclosure is in contact with the first surface and the second surface while covering the circuit board and has an insertion hole to be fitted to the projection.SELECTED DRAWING: Figure 1 【課題】プラグと回路基板との間の接続不良の発生を抑制する。【解決手段】半導体装置は、第１の接続パッドを含む複数の接続パッドを有する配線基板と、配線基板に搭載された半導体チップと、を備える回路基板と、第１の面と第１の面の反対側に位置する第２の面とを含む外周面を有する筐体部と、外周面に囲まれた中空部と、筐体部から第１の面または第２の面と異なる方向に延在する突起と、を有する第１の筐体と、中空部の内部から外部に延在し、第１の接続パッドに電気的に接続された接続端子と、を備えるプラグと、回路基板を覆いつつ第１の面および第２の面に接し、突起と嵌合する差込穴を有する第２の筐体と、を具備する。【選択図】図１