METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT

• Main Authors: SHIMIZU TOSHIHIRO, HIRAI EIKI, TAKABE HONKI, OSAWA EIJI, NAKAYAMA MASAO
• Format: Patent
• Language: English; Japanese
• Published: 16.03.2017
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric element with improved reliability by suppressing leakage current and peeling of electrodes.SOLUTION: A method 300 of manufacturing a piezoelectric element including a first electrode 60, a piezoelectric layer 70, and a second electrode 80 including a first platinum layer 81a and a second platinum layer 81b includes: forming by a sputtering method the first platinum layer 81a having a compressive stress on the piezoelectric layer 70 provided on the first electrode 60; and forming by the sputtering method the second platinum layer 81b having a tensile stress with lower sputtering power than that when the first platinum layer 81a is formed on the first platinum layer 81a.SELECTED DRAWING: Figure 5 【課題】リーク電流及び電極の剥離を抑制して信頼性が向上した圧電素子の製造方法を提供する。【解決手段】第１電極６０と、圧電体層７０と、第１白金層８１ａ及び第２白金層８１ｂを含む第２電極８０とを備える圧電素子３００の製造方法であって、第１電極６０上に設けられた圧電体層７０上に、スパッター法により圧縮応力を有する第１白金層８１ａを形成し、第１白金層８１ａを形成したときよりも低いスパッター電力でスパッター法により引張応力を有する第２白金層８１ｂを第１白金層８１ａ上に形成する。【選択図】図５