WIRING BOARD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a wiring board, a semiconductor device, and a semiconductor package having a high cooling performance.SOLUTION: A wiring board according to an embodiment comprises: an insulation substrate configured by a ceramic material, and on whose one principal surface a wiring...

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Bibliographic Details
Main Authors WATANABE NAOTAKE, UEDA KAZUHIRO, MARUNO KOJI, KURITA HIROSHI, HISADA HIDEKI, KOTANI KAZUYA
Format Patent
LanguageEnglish
Japanese
Published 16.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wiring board, a semiconductor device, and a semiconductor package having a high cooling performance.SOLUTION: A wiring board according to an embodiment comprises: an insulation substrate configured by a ceramic material, and on whose one principal surface a wiring layer for mounting components is formed; and a base plate arranged at the other side of the insulation substrate, and that has a projection protruded outward from an outer peripheral edge of the insulation substrate, and that has a thickness larger than that of the insulation substrate.SELECTED DRAWING: Figure 1 【課題】冷却性能の高い配線基板、半導体装置、及び半導体パッケージを提供することを特徴とする。【解決手段】実施形態に係る配線基板は、セラミックス材で構成され、一方の主面に部品が実装される配線層が形成された絶縁基板と、前記絶縁基板の他方側に配され、前記絶縁基板の外周縁より外方に突出する突出部を有し、前記絶縁基板よりも厚さが大きいベースプレートと、を備える。【選択図】図１
Bibliography:Application Number: JP20150175341