MULTILAYER SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

• Main Authors: HASEGAWA KENICHIRO, YOKOCHI TOMOHIRO, KASAMA YASUNORI
• Format: Patent
• Language: English; Japanese
• Published: 09.03.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To improve flatness of a multilayer substrate after hot press.SOLUTION: In a manufacturing method of a multilayer substrate 1, at least two land electrodes 11 are arranged in a laminate 20 before hot press in a shifted manner from each other when viewed from a lamination direction to thereby arrange at least two clearances 22 lying in the lamination direction in a shifted manner from each other when viewed from the lamination direction. By hot press on the laminate 20, a resin material composing a resin film 10 flows to fill the clearances 22 inside the laminate 20. By doing this, flatness of the multilayer substrate 1 can be improved compared to the case where the plurality of clearances 22 lying in the lamination direction are located at the same position when viewed from the lamination direction.SELECTED DRAWING: Figure 2B 【課題】加熱プレス後の多層基板の平坦性を向上させる。【解決手段】加熱プレス前の積層体２０において、少なくとも２つ以上のランド電極１１を、積層方向から見て、互いにずらして配置することで、積層方向に並ぶ少なくとも２つ以上の隙間２２を、積層方向から見て、互いにずらして配置する。この積層体２０を加熱プレスすることで、樹脂フィルム１０を構成する樹脂材料が流動して積層体２０の内部の隙間２２が埋められる。これによれば、積層方向に並ぶ複数の隙間２２が積層方向から見て同じ位置にある場合と比較して、多層基板１の平坦性を向上させることができる。【選択図】図２Ｂ