POWER MODULE, HEAT RADIATION STRUCTURE OF POWER MODULE, AND JOINT METHOD FOR POWER MODULE

PROBLEM TO BE SOLVED: To provide a power module which secures sufficient cooling performance, inhibits degradation caused by overheating, and achieves high reliability, and to provide a heat radiation structure of the power module and a joint method for the power module.SOLUTION: A power module 100...

Full description

Saved in:
Bibliographic Details
Main Author YOSHIHARA KATSUHIKO
Format Patent
LanguageEnglish
Japanese
Published 09.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a power module which secures sufficient cooling performance, inhibits degradation caused by overheating, and achieves high reliability, and to provide a heat radiation structure of the power module and a joint method for the power module.SOLUTION: A power module 100 includes: a heat sink 106c to which a semiconductor chip (not shown) is joined; a package 101 which seals outer surroundings of the semiconductor chip so as to expose at least a part of the heat sink 106c; and a thickness control protrusion 104 which regulates a thickness of a heat conduction material 120 when the heat sink 106c is joined to a cooler 110 by using the heat conduction material 120.SELECTED DRAWING: Figure 3 【課題】充分な冷却性能を確保でき、過熱による劣化を抑えることが可能な、信頼性の高いパワーモジュール、パワーモジュールの放熱構造、およびパワーモジュールの接合方法を提供する。【解決手段】パワーモジュール１００は、図示していない半導体チップが接合されたヒートシンク１０６ｃと、ヒートシンク１０６ｃの少なくとも一部を露出させるようにして、半導体チップの外囲を封止するパッケージ１０１と、ヒートシンク１０６ｃを、熱伝導材１２０を用いて冷却器１１０に接合する際の、熱伝導材１２０の厚さを規制する厚さ制御用突起部１０４とを備える。【選択図】図３
Bibliography:Application Number: JP20150171799