METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE

• Main Authors: SUZUKI NAOYA, TAKAHASHI HIROSHI, NARITA TAKENORI, MASUDA TOMOYA
• Format: Patent
• Language: English; Japanese
• Published: 02.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component device with excellent productivity, and the electronic component device manufactured by the method.SOLUTION: A method for manufacturing an electronic component device comprises: an imparting step of imparting a curable composition containing an acrylate compound to at least one surface selected from the group consisting of a surface facing a substrate of an electronic component and a surface on the side facing the electronic component of the substrate; a pressurizing step of filling the gap between the electronic component and the substrate with the curable composition by pressurizing the substrate and the electronic component in a state in which they face to each other via a bump and bringing the electronic component into contact with the substrate via the bump; a temporary heating step of bringing a member of a temperature not lower than a solder melting temperature into contact with the electronic component for three seconds or less; and a main heating step of joining the electronic component and the substrate via the bump in a state in which the member is removed from the electronic component.SELECTED DRAWING: None 【課題】生産性に優れる電子部品装置の製造方法及び前記方法により製造される電子部品装置を提供する。【解決手段】電子部品の基板と対向する面及び前記基板の前記電子部品と対向する側の面からなる群より選択される少なくとも一方に、アクリレート化合物を含む硬化性組成物を付与する付与工程と、前記基板と前記電子部品とがバンプを介して対向している状態で加圧して、前記電子部品と前記基板との間の空隙に前記硬化性組成物を充填し、かつ、前記電子部品と前記基板とを前記バンプを介して接触させる加圧工程と、前記電子部品に、はんだ溶融温度以上の温度の部材を３秒以下の時間接触させる仮加熱工程と、前記部材を前記電子部品から外した状態で前記電子部品と前記基板とを前記バンプを介して接合する本加熱工程と、を有する電子部品装置の製造方法。【選択図】なし