CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

• Main Authors: TAKAGI KOTARO, WATANABE TOMOKAZU, ASANO KOJI
• Format: Patent
• Language: English; Japanese
• Published: 02.03.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a circuit board capable of suppressing warpage of a core substrate including a glass cloth, and a method of manufacturing the same.SOLUTION: A circuit board 10 of the present invention includes: a core substrate 11 including a glass cloth 70; conductor heat transfer layers 13A and 13B formed on both front and rear sides of the core substrate 11 respectively; through hole heat transfer conductors 17 which are formed by filling heat-transferring through holes 16 penetrating the core substrate 11 with plating and connect the conductor heat transfer layers 13A and 13B to each other; build-up layers 20A and 20B laminated on the conductor heat transfer layers 13A and 13B; and an electronic component mounting part 80J which is provided at the outermost part of the build-up layer 20A on the front side and on which an electronic component 80 is mounted. The heat-transferring through holes 16 include outside heat-transferring through holes 16S which are arranged outside the electronic component mounting part 80J when viewed from the thickness direction of the circuit board 10 and extend in a direction intersecting warp 71A and weft 71B forming the glass cloth 70.SELECTED DRAWING: Figure 2 【課題】ガラスクロスを含むコア基板の反りを抑制可能な回路基板及びその製造方法の提供を目的とする。【解決手段】本発明の回路基板１０は、ガラスクロス７０を含むコア基板１１と、コア基板１１の表側と裏側の両方にそれぞれ形成される導体伝熱層１３Ｂと、コア基板を貫通する伝熱用貫通孔１６にめっきを充填してなり、導体伝熱層１３Ｂ，１３Ｂ同士の間を接続するスルーホール伝熱導体１７と、導体伝熱層１３Ｂ上に積層されるビルドアップ層２０Ａ，２０Ｂと、表側のビルドアップ層２０Ａの最外部に設けられて電子部品８０が実装される電子部品実装部８０Ｊと、を有し、伝熱用貫通孔１６として、回路基板１０の厚み方向から見たときに電子部品実装部８０Ｊの外側に配置され、且つ、ガラスクロス７０を形成する縦糸７１Ａ又は横糸７１Ｂと交差する方向に延びる外側伝熱用貫通孔１６Ｓを有する。【選択図】図２