HEATING HEADER OF SEMICONDUCTOR MOUNTING DEVICE AND BONDING METHOD OF SEMICONDUCTOR

• Main Authors: KIRA HIDEHIKO, KAINUMA NORIO, MASUYAMA TAKUMI
• Format: Patent
• Language: English; Japanese
• Published: 02.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To join terminals each other with a low load, by suppressing warpage of a semiconductor chip.SOLUTION: A heating header of a semiconductor mounting device includes a first material, and a second material being bonded to the first material, and coming into contact with a first semiconductor chip when compressing it. The contact surface with the first semiconductor chip in the second material is a curved surface convex toward the first semiconductor chip side. When the temperature of the first and second materials reaches the fusion temperature of a solder formed between the first terminal of the first semiconductor chip and the second terminal of the second semiconductor chip, the contact surface with the first semiconductor chip in the second material becomes a flat surface.SELECTED DRAWING: Figure 2 【課題】半導体チップの反りを抑制し、低荷重で端子同士の接合を行う。【解決手段】半導体実装装置の加熱ヘッダは、第１材料と、前記第１材料に接合され、かつ、第１半導体チップを加圧する際に前記第１半導体チップに接触する第２材料と、を備え、前記第２材料における前記第１半導体チップとの接触面が、前記第１半導体チップ側に向かって凸の曲面であり、前記第１材料及び前記第２材料の温度が、前記第１半導体チップの第１端子と第２半導体チップの第２端子との間に形成された半田の溶融温度に到達すると、前記第２材料における前記第１半導体チップとの接触面が平面になる。【選択図】図２