MAGNETIC FIELD DETECTOR

PROBLEM TO BE SOLVED: To provide a magnetic field detector capable of reducing stress and increasing detection accuracy.SOLUTION: In an IC package 20, a magnetic detection element 21 and lead frames 22 connected to the magnetic detection element 21 are molded by a resin material 23. A terminal 30 is...

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Bibliographic Details
Main Authors NISHIMOTO SEIJI, TAKIGUCHI TOMOYUKI, KONO SADAYUKI, MIZUTANI AKITOSHI
Format Patent
LanguageEnglish
Japanese
Published 02.03.2017
Subjects
ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
PHYSICS
SEMICONDUCTOR DEVICES
TARIFF METERING APPARATUS
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a magnetic field detector capable of reducing stress and increasing detection accuracy.SOLUTION: In an IC package 20, a magnetic detection element 21 and lead frames 22 connected to the magnetic detection element 21 are molded by a resin material 23. A terminal 30 is connected to areas of the IC package 20 where the lead frames 22 are protruded from the resin material 23. A resin mold body 40 has a foundation part 41 and a head 42, and molds a part of the IC package and the terminals. The foundation part 41 is formed in a trapezoidal shape, and molds a portion including the connected areas between the lead frames 22 and the terminals 30. The head 42 is protruded from the foundation part 41 toward an opposite side from the terminals 30, and molds a portion including the magnetic detection element 21 of the IC package 20. An element corresponding surface 24 being an outer wall surface of the IC package 20 which is positioned on the magnetic detection element 21 side with respect to the lead frames 22 is exposed from the resin mold body 40.SELECTED DRAWING: Figure 4 【課題】 応力を低減し、検出精度を高めることの可能な磁界検出装置を提供する。【解決手段】 ＩＣパッケージ２０は、磁気検出素子２１と、磁気検出素子２１に接続されたリードフレーム２２とが樹脂材２３によりモールドされている。ターミナル３０は、ＩＣパッケージ２０のリードフレーム２２が樹脂材２３から突出した箇所に接続されている。樹脂モールド体４０は、基礎部４１および頭部４２を有し、ＩＣパッケージとターミナルの一部とをモールドする。基礎部４１は、台状に形成され、リードフレーム２２とターミナル３０との接続箇所を含む部分をモールドする。頭部４２は、基礎部４１からターミナル３０とは反対側に向かって突出し、ＩＣパッケージ２０の磁気検出素子２１を含む部分をモールドする。リードフレーム２２に対し磁気検出素子２１側に位置するＩＣパッケージ２０の外壁面である素子対応面２４は、樹脂モールド体４０から露出している。【選択図】 図４
Bibliography:Application Number: JP20160116888