RESIN COMPOSITION AND SHEET THEREOF

• Main Authors: NAKAMURA HIDEKI, NAGANUMA KENJI
• Format: Patent
• Language: English; Japanese
• Published: 02.03.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a resin composition having thermal conductivity and fire retardancy, flexible and high in thickness accuracy and capable absorbing vibration.SOLUTION: There is provided a resin composition containing (A) a copolymer containing a conjugated diene unit and a vinyl aromatic compound unit and/or a hydrogenated article thereof of 2 to 20 mass%, (B) a softener for rubber of 2 to 20 mass% and (C) a thermal conductive filler of 70 to 95 mass%, where the (C) thermal conducive filler has 2 different maximum values in particle size distribution thereof and difference of particle diameters of particles exhibiting each of maximum values is 50 μm or more.SELECTED DRAWING: None 【課題】熱伝導性と難燃性を有し、柔軟で厚み精度が高く、かつ振動を吸収できる樹脂組成物及びそのシートを提供することを目的とする。【解決手段】（Ａ）共役ジエン単位とビニル芳香族化合物単位とを含む共重合体及び／又はその水素添加物２〜２０質量％、（Ｂ）ゴム用軟化剤２〜２０質量％、及び（Ｃ）熱伝導性充填材７０〜９５質量％、を含む樹脂組成物であって、前記（Ｃ）熱伝導性充填材は、その粒度分布において２つ以上の異なる極大値を有し、かつそれぞれの極大値を示す粒子径の差が少なくとも５０μｍ以上である、樹脂組成物。【選択図】なし