LIGHT EMITTING DEVICE AND MANUFACTURING METHOD FOR THE SAME
PROBLEM TO BE SOLVED: To provide a light emitting device which radiates heat generated by light emission of a light emitting element in a more efficient manner.SOLUTION: A light emitting device 1 includes: a mounting substrate 10 having a mounting region 11; a frame 40 which is adhered to a surface...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
16.02.2017
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To provide a light emitting device which radiates heat generated by light emission of a light emitting element in a more efficient manner.SOLUTION: A light emitting device 1 includes: a mounting substrate 10 having a mounting region 11; a frame 40 which is adhered to a surface of the mounting region 11 on a rear surface and formed by a porous material; light emitting elements 30 which are adhered to a surface of the frame 40 on rear surfaces; bonding wires 31 connected to element electrodes 32 and 33 formed on surfaces of the light emitting elements 30; and a sealing resin 60 for sealing the frame 40, the light emitting elements 30, and the bonding wires 31.SELECTED DRAWING: Figure 1
【課題】発光素子の発光により発生する熱をより効率的に放熱可能な発光装置を提供する。【解決手段】発光装置1は、実装領域11を有する実装基板10と、実装領域11の表面に裏面が接着された多孔質材料で形成された架台40と、架台40の表面に裏面が接着された発光素子30と、発光素子30の表面に形成された素子電極32、33に接続されたボンディングワイヤ31と、架台40、発光素子30及びボンディングワイヤ31を封止する封止樹脂60と、を有する。【選択図】図1 |
---|---|
Bibliography: | Application Number: JP20150160170 |