LAMINATION TYPE IMAGE SENSOR AND IMAGING DEVICE

PROBLEM TO BE SOLVED: To realize a technique capable of easily bending an image plane of a lamination type image sensor.SOLUTION: The lamination type image sensor is formed by laminating an imaging chip for taking an image and a processing chip for processing an output signal from the imaging chip....

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Bibliographic Details
Main Author KOBAYASHI TARO
Format Patent
LanguageEnglish
Japanese
Published 16.02.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To realize a technique capable of easily bending an image plane of a lamination type image sensor.SOLUTION: The lamination type image sensor is formed by laminating an imaging chip for taking an image and a processing chip for processing an output signal from the imaging chip. At least part of an image plane of the imaging chip is bendable. The imaging chip and the processing chip are mutually connected at a peripheral part of a pixel region.SELECTED DRAWING: Figure 4 【課題】積層型イメージセンサの撮像面を容易に湾曲できる技術を実現する。【解決手段】画像を撮像する撮像チップと、撮像チップからの出力信号を処理する処理チップとが積層された積層型イメージセンサであって、前記撮像チップの撮像面の少なくとも一部が曲げ変形可能であり、前記撮像チップと前記処理チップは、画素領域の周辺部分で互いに接続されている。【選択図】図４
Bibliography:Application Number: JP20150159136